The T1 Telco Accelerator Card from Xilinx turns a standard server into a processor capable of handling 5G data streams.
MediaTek introduces 5G SoCs for phones and home networking
The Dimensity 1000C supports 5G phones, handling many functions while the T750 adds 5G and other connectivity to routers and hotspots.
IMS 5G Summit: Design challenges remain (part 2)
Part 2 continues the theme of power and efficiency in amplifiers, adding upload links, fixed access, and open RAN.
DSP core processes 5G baseband data
5G Technology World spoke with Moshe Sheier and Nir Shapira of CEVA to learn how the company’s DSP core handles 5G baseband signals from I/O data to the transport network.
The slide keyboard is back, in a 5G phone
Planet Computers has designed a 5G phone that has a slide keyboard, but not your typical slide keyboard. 5G Technology World spoke with the designer to learn how it works.
Add a 5G PHY to your design
PHYRefChain-5G from CommAgility lets you add a 5G physical later to an FPGA, ASIC, or other silicon device.
5G is hot, keep your components and systems cool
5G’s antennas and the devices that drive them generate more heat than their LTE predecessors. That creates new cooling problems for wireless devices and systems. If you listen to and read the hype surrounding 5G, you’ll come away thinking that 5G is truly hot. That’s the marketing perspective. From an engineering design perspective, 5G is…
5G moves into production, causes test issues
5G Technology World talks with Teradyne’s Jeorge Hurtarte, who explains components and over-the-air production test of 5G components. 5G phones, base stations, IoT, and other devices have moved into production, but like everything else, 5G’s mmWave frequencies bring new challenges there, just as they have with design and deployment. For starters, production facilities don’t what…
X60 Modem aggregates mmWave and sub-6 GHz carriers
Qualcomm’s Snapdragon X60 5G modem builds on its two 5G predecessors—the X50 and X55—by adding sub-6 GHz and mmWave carrier aggregation, plus other features. According to Qualcomm, the 5 nm process used to fabricate the X60 provides higher power efficiency into a smaller footprint. Additional features include: 5G frequency-division duplex (FDD) and time-division duplex (TDD)…
Chipset family offers SoCs with integrated 5G modems in 7nm package
MediaTek introduced its Dimensity 800 Series 5G chipset family that will bring flagship features, power and performance to New Premium mid-range 5G smartphones. MediaTek’s Dimensity 5G chipset family offers powerful system-on-chips (SoCs) with integrated 5G modems. The single-chip solutions offer an unrivaled combination of connectivity, multimedia, AI and imaging innovations packed into an ultra-efficient 7nm…